High-Reliability Microelectronic Packaging for Modern Military Systems Advanced Die Bonding and Fiber Optics for Mission-Critical Defence Electronics

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Tresky GmbH

GGB Heilbronn GmbH

With military platforms becoming smaller, more autonomous and software-driven, demands on electronic assemblies are rising. Tresky GmbH, a specialist in precision semiconductor assembly solutions, is addressing these challenges with advanced die bonding systems and fiber optic integration, tailored for high-performance defence and security applications.

In today’s defence industry, specialised electronics form the backbone of nearly every platform — from fighter aircraft and unmanned aerial vehicles to missile systems, sensors, communications gear and soldier-worn devices. A key enabling technology is die bonding, the precise and permanent attachment of semiconductor chips to substrates, printed circuit boards or housings. These bonds must remain mechanically stable, thermally conductive and electrically reliable under extreme operating conditions.

Tresky’s die bonding technologies include thermo-compression, epoxy, eutectic, sintering and photonics bonding. Each method can be optimised for mechanical robustness, thermal performance and electrical reliability. The choice of bonding process directly impacts device heat dissipation and operational lifespan. For example, advanced materials such as silver sinter pastes, with thermal conductivity values exceeding 200–250 W/mK, improve thermal management in high-power defence electronics, reducing overheating risk and maintaining performance under stress.

Miniaturisation is another driver. Modern defence systems demand maximum functionality in the smallest possible footprint. Direct chip attach, Chip-on-Board (CoB) and System-in-Package (SiP) approaches allow multiple dies to be integrated into a single compact module, improving space efficiency, performance and reliability. This is particularly relevant for UAVs, guided munitions, portable radios and soldier assistance systems.

High-frequency and radar applications — including AESA radars, transceiver modules and satellite communications — require micrometre-accurate die placement to ensure optimal signal integrity and minimise parasitic effects. Faults in bonding can cause severe performance degradation, making process reliability essential for mission effectiveness.

Fiber optic technologies are also becoming a core element of modern defence systems, offering secure, high-speed data transmission immune to electromagnetic interference and EMP. They support applications ranging from precision weapons and LIDAR to infrared targeting, “fly-by-light” flight control, and secure battlefield communications. Integration with die bonding processes ensures optical components withstand vibration, temperature extremes and humidity in both mobile and fixed military infrastructure. 

“From precision satellite thrusters to reusable launch vehicle systems, our niobium alloys combine high-temperature stability with mechanical durability, providing a robust material foundation for future space missions,” said Daniel Schultze, CEO of Tresky GmbH. “For defence electronics, robust die bonding is mission-critical — every connection must perform flawlessly, because any failure can have serious consequences.”

By combining advanced die bonding techniques, high-conductivity materials and expertise in fibre optic integration, Tresky contributes to the resilience, compactness and longevity of defence electronics designed to operate in the harshest conditions.